| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which the soldering properties of a part for connecting the electronic part of a conductive layer formed on the surface of the wiring board is proper. SOLUTION: The wiring board includes a plurality of conductive layers (2) each made of a metal on both the main surfaces of an electrical insulating layer (1). The conductive layers (2) are connected between the layers (2) by a conductive paste (6) inside a pore penetrated in the thickness direction of the electrical insulating layer (1). The connecting part (4) of the electronic part is covered with a metal different from the metal for constituting the conductive layer (2). The conductive layer (2) is formed of at least one metal selected from the group consisting of copper, copper alloy, aluminum, nickel, gold, silver and tin. The coating metal (8) of the front surface of the one metal is formed of at least one metal selected from the group consisting of tin, tin alloy, bismuth, nickel, gold and palladium. COPYRIGHT: (C)2005,JPO&NCIPI
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