CHIP-SIZE PACKAGE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a chip-size package semiconductor device whose connection state can be easily ascertained even when its electrodes are located on the back of a package. SOLUTION: The chip-size package semiconductor device is equipped with mounting electrodes 3 provided on the back of a package board 2 mounted with an IC chip 1, and monitoring electrodes 6 electrically connected to the mounting electrodes 3 respectively are provided to the peripheral region of the back of the package board 2 at a region outside of the mounting electrodes 3. By this setup, the connection state of the device can be ascertained by an electric check through the monitoring electrodes 6 without using a conventional boundary scan circuit. COPYRIGHT: (C)2005,JPO&NCIPI