| 摘要 |
PROBLEM TO BE SOLVED: To provide an acidic copper plating liquid with which the interior of the gaps of a surface to be plated of a wafer and the like having the gaps of submicron level can be completely embedded with copper plating and copper plating treatment of high uniformity can be performed, and to provide an electroplating method using the same. SOLUTION: The acidic copper plating liquid contains copper ions, an organic acid or inorganic acid, chlorine ions, a polymeric surfactant for suppressing an electrodeposition reaction, and a sulfur-based saturated organic compound for accelerating an electrodeposition rate. In the liquid, at least two or more varying in hydrophobicity are used as the polymeric surfactant. The electrolytic plating method comprises performing plating treatment at cathode current density of 0.1 to 30 mA/cm<SP>2</SP>by using the copper plating liquid. COPYRIGHT: (C)2005,JPO&NCIPI
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