| 摘要 |
PROBLEM TO BE SOLVED: To provide a steel material for a member of a semiconductor-manufacturing apparatus, which can be smoothed into desired surface roughness by electrolytic polishing in a short period of time and has superior gouge resistance when cut. SOLUTION: The steel material for the member of the semiconductor-manufacturing apparatus comprises 10-25% Ni, 15-30% Cr, 2-7% Mo, 0.02% or less C, 0.30% or less Si, 0.02% or less Mn, 0.04% or less P, 0.002% or less S, 0.010% or less Al, 0.0010% or less Ca, 0.02% or less Mg, 0.002% or less O (oxygen) and the balance Fe with impurities; and contains MnS, CaS and MgS having longer diameters of 3μm or larger, of which the sum of the number is less than 1/mm<SP>2</SP>in a longitudinal section. COPYRIGHT: (C)2005,JPO&NCIPI
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