发明名称 COPPER POWDER AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To obtain a copper powder having a suitable particle size distribution for the filler of a conductive paste, by reproducibly manufacturing copper powders each having an aimed and uniform particle size, and mixing the copper powders of different particle sizes. SOLUTION: The method for manufacturing the copper powder having a narrow width of the particle size distribution comprises adding a reducing agent to (1) a mixture comprising a copper powder with an average particle size of 0.1μm or larger, a solid component consisting of a copper compound, and a liquid medium, (2) a mixture comprising the copper powder with an average particle size of 0.1μm or larger, and a liquid medium including copper ions, or (3) a mixture comprising the copper powder with the average particle diameter of 0.1μm or larger, the solid component consisting of the copper compound, and the liquid medium including the copper ions; and reducing the solid component and/or the copper ions to metallic copper. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004307881(A) 申请公布日期 2004.11.04
申请号 JP20030099515 申请日期 2003.04.02
申请人 DOWA MINING CO LTD 发明人 OKADA YOSHIHIRO;HIRATA AKITSUGU
分类号 B22F9/20;B22F1/00;B22F9/24;(IPC1-7):B22F9/20 主分类号 B22F9/20
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