| 发明名称 |
Device having resin package and method of producing the same |
| 摘要 |
A device including a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic film.
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| 申请公布号 |
US2004219719(A1) |
申请公布日期 |
2004.11.04 |
| 申请号 |
US20040856777 |
申请日期 |
2004.06.01 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
YONEDA YOSHIYUKI;TSUJI KAZUTO;ORIMO SEIICHI;SAKODA HIDEHARU;NOMOTO RYUJI;ONODERA MASANORI;KASAI JUNICHI |
| 分类号 |
H01L21/00;H01L21/48;H01L21/56;H01L21/68;H01L21/683;H01L23/31;H01L25/10;H01L29/06;H05K1/18;H05K3/30;H05K3/34;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/00 |
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