| 发明名称 |
Semiconductor packaging structure |
| 摘要 |
A housing (30) for a semiconductor element (72) comprises a substrate (32) connected to an attachment surface of a circuit board on one side (46) with a recess (48) in this side containing a semiconductor piece (34). The other side of the semiconductor opposite to the attaching surface is attached to the substrate at a section (74). |
| 申请公布号 |
US2004217451(A1) |
申请公布日期 |
2004.11.04 |
| 申请号 |
US20030649006 |
申请日期 |
2003.08.26 |
| 申请人 |
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发明人 |
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| 分类号 |
H01L23/12;H01L23/02;H01L23/055;H01L23/36;H01L23/498;H01L31/02;H01L33/56;H01L33/62;H01L33/64;(IPC1-7):H01L23/495 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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