SOLDERING METHOD AND PRINTED WIRING BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a soldering method using lead-free solder which can prevent the occurrence of solder balls even by using an atmospheric reflow method when mounting electronic components on a printed wiring board by means of a heating device using lead-free solder. SOLUTION: Soldering is conducted in such a temperature profile that the temperature in a pre-heating region is 170°C or below and the duration thereof is 100 sec. or less. COPYRIGHT: (C)2005,JPO&NCIPI