Heat sink for cooling semiconductor device, separated from housing of electronic circuitry, e.g. in explosive atmosphere, has heat sink attached to metal block attached to outer wall of housing

摘要

The semiconductor device (2) is attached directly to the inner wall of the housing (3), and a heat conductor in the form of a metal block (5) is attached to the outer side of the housing. The heat sink is attached to the metal block. The semiconductor device may be attached to the inner wall via an electrical insulator.