发明名称 INSPECTION METHOD AND DEVICE FOR ELECTRONIC COMPONENT
摘要 <p><P>PROBLEM TO BE SOLVED: To measure accurately the bond strength of an electrode terminal for external connection on the interface between the electrode terminal for external connection and the electrode. <P>SOLUTION: In the inspection method of an electronic component, the bond strength of the electrode terminal 101 for external connection is inspected from the broken form of the joint 105 by applying a shearing force to the joint 105 of the electrode 103 and the electrode terminal 101, by pushing the electrode terminal 101 joined to the electrode 103 of an electronic component from lateral. The pushing direction of the electrode terminal 101 has an angle 302 inclined upward to the surface of the electrode 103. As a result, the angle 302 is given to the electronic component, and the electrode terminal 101 is sheared aslant, so that vertical upward component of force can be generated in the joint 105. As a result, the bond strength of the electrode terminal 101 for external connection can be measured accurately, and quality decision of electrode formation becomes enable. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004311623(A) 申请公布日期 2004.11.04
申请号 JP20030101393 申请日期 2003.04.04
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 SEKINAGA SEI;MATSUSHITA KOICHI;MATSUSHIMA HIROSHI
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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