| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacturing method for the same, which prevent the corrosion of a circuit part by moisture to ensure the high reliability of the semiconductor. SOLUTION: In a seal ring 12 comprising wirings and vias, which is arranged to completely enclose the circuit part 13, the bottom peripheries of sealing wirings 118, 128 are formed to penetrate into the adjacent under layers of inter-layer insulating films 5. Also, sealing vias 119, 129 are arranged and connected to be shifted horizontally relative to sealing wirings 118, 128 in the adjacent under layers, and part of the bottoms of the sealing vias 119, 129 are made to penetrate into the adjacent under layers 3. Thus moisture penetration through interfaces A-A' between stopper films 4 and the inter-layer insulating films 5 and through interfaces B-B' between stopper films 6 and the inter-layer insulating films 3 is prevented completely. COPYRIGHT: (C)2005,JPO&NCIPI |
