| 摘要 |
PROBLEM TO BE SOLVED: To reduce a coupling noise in an integrated circuit electromagnetically or via a substrate. SOLUTION: Laminated metal wiring layers 5, 7, 9 and 11 form an electromagnetic isolation structure. These metal wiring layers are connected to each other through vias 6, 8 and 10, and a metal fence 20 of the laminated structure is thereby formed. The metal fence 20 is disposed to surround an element, such as a spiral inductor 12, etc. for generating an electromagnetic field in the integrated circuit. When a signal wavelengthλ=c/f is set, d≤λ/8, WF≥5δ, and L≤λ/20 are satisfied, whereinδis the skin depth of an electromagnetic wave, c is the velocity of a light, f is the operating frequency of the integrated circuit 21, d is the lateral size of the metal fence region, WF is the surrounding line width of the metal fence, and L is an interval between the vias. COPYRIGHT: (C)2005,JPO&NCIPI |
