| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for measuring the height of a bump having high measurement reproducibility. SOLUTION: The method for measuring the height of the bump irradiates a wafer 1 on which a bump electrode is formed with laser lights 3a and 3b for the scanning in the uniaxial direction at a prescribed angle, detects the imaging position of the reflected lights 5a and 5b from the wafer 1 at a prescribed frequency, and performs the conversion into the height of the bump by arithmetically processing the amount of displacement of the imaging position. Two or more systems perform the irradiation with the laser lights 3a and 3b and the detection of the imaging position of the reflected lights 5a and 5b, in which the detected position at the wafer 1 in each of the systems has the deviation. COPYRIGHT: (C)2005,JPO&NCIPI
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