| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor integrated device having an external wiring on the device side, which can improve corrosion resistance of the external wiring. SOLUTION: The above problem can be solved by the method of manufacturing a semiconductor integrated device. The method includes an external wiring forming process S16-1 for patterning a metal film formed on the side face of a laminate using a resist to form the external wiring, a resist releasing process S16-2 for removing the resist with a releasing agent, and a releasing agent cleaning process S16-3 for dipping the laminate in pure water stored in a washing tank to wash the releasing agent with water and for repeating washing until the resistance value of the pure water stored in the washing tank becomes 16 MΩor more. COPYRIGHT: (C)2005,JPO&NCIPI
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