发明名称 RELAY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a relay device with reduce bounding of a movable contact in order to prevent wear/adhesion. SOLUTION: The contact face of the fixed contacts 21a, 21b and movable contacts 22a, 22b of the relay device is made a slanted face, thereby, reaction force generated in the movable contact 22a, 22b is dispersed and bounding generated in a movable plate 15 is reduced. Further, the position of the acting point of a plunger 12 and a contact spring 14 to the movable plate 15 is made lower than the position of the center of gravity of the movable plate. The plunger 12 is constructed by a cylinder filled with fluid and a damper piston to be connected to the movable plate 15, and an impact absorption member is provided at the contact face side with the contact spring 14 of the movable plate. Furthermore, the bounding can be reduced by constructing the movable plate 15, fixed contacts 16a, 16b, and movable contacts 17a, 17b by a conductive damping material. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004311293(A) 申请公布日期 2004.11.04
申请号 JP20030105312 申请日期 2003.04.09
申请人 TOYOTA MOTOR CORP;NIPPON SOKEN INC 发明人 MATSUOKA HISANAGA;ODA KIYOSHIGE;YAMASHITA KAZUYUKI;KATSUTA TOSHIHIRO;MATSUKI TSUTOMU
分类号 H01H50/30;H01H1/50;H01H50/54;(IPC1-7):H01H50/30 主分类号 H01H50/30
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