| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering cathode and a sputtering apparatus capable of suppressing the cost for working a target, unifying the film thickness distribution similarly to a known method without increasing the size of the apparatus, and in addition, increasing the film deposition speed. SOLUTION: The sputtering cathode has a freely tiltable target with respect to a substrate to be treated. In addition, the sputtering cathode is freely controlled with respect to the distance from the substrate to the target by moving the target. COPYRIGHT: (C)2005,JPO&NCIPI
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