发明名称 SUBSTRATE BEARING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate bearing device which only requires replacement of an attachment depending on the type of a substrate, without adjustment of complicated suction force, sucks the substrate with vacuum, bears the substrate mounted on a substrate mounting surface so as not to be distorted, and without the deviation of a solder ball mounting location. SOLUTION: The substrate bearing device which bears the substrate mounted on the substrate mounting surface by sucking, is formed by detachably arranging an attachment on which the substrate is directly mounted, on a substrate stage. The attachment has formed therein the substrate mounting surface having a suction port, a gas passage connected to a negative pressure source via the substrate stage, for introducing negative pressure to the suction port, and an outside air introducing port for introducing outside air into the gas passage. Herein the attachment is replaceable depending on the type of the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004306156(A) 申请公布日期 2004.11.04
申请号 JP20030099357 申请日期 2003.04.02
申请人 SHIBUYA KOGYO CO LTD 发明人 KAJII YOSHIHISA
分类号 B23Q3/08;H01L21/60;(IPC1-7):B23Q3/08 主分类号 B23Q3/08
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