| 摘要 |
A system for testing semiconductor die on multiple semiconductor wafers includes a testing unit (82), a test fixture bank (84) operably coupled to the testing unit (82), a plurality of test fixture racks (86-92) operably coupled to the test fixture bank (84) and a plurality of wafer-interposer assemblies (94-140) operably coupled to each of the test fixture racks (86-92). Each of the wafer-interposer assemblies (94-140) includes a semiconductor wafer having a plurality of semiconductor die and an interposer coupled to the semiconductor wafer. The interposer has a first set of conductors for electrically connecting the semiconductor die of the semiconductor wafer to a substrate and a second set of conductors that electrically connect the semiconductor die of the semiconductor wafer to the test fixture rack (86-92) via a connector, thereby providing for addressing and testing of the semiconductor die.
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