| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a multi-wire wiring board constituted of a high density and high multilayer and having high positional accuracy without reducing operability of substrates in processes. SOLUTION: The method for manufacturing a multi-wire wiring board comprises a process for forming a copper foil layer (2) and an insulating layer (3) which can be peeled off from a base board (1) on one or both surfaces of the base board (1), a process for forming an adhesive layer (4) for fixing an insulating coated wire (5) on the surface of the insulating layer (3), a process for fixing the insulating coated wire (5) on the surface of the adhesive layer (4), a process for forming an insulating layer (6) and a copper foil layer (7) on the surface where the insulating coated wire (5) is fixed on the adhesive layer (4), a process for peeling off a substrate (8) constituted of layers from the copper foil layer (2) up to the copper foil layer (7) from the base board (1), a process for forming a circuit on the copper foil layer (2) and the copper foil layer (7) formed on the surface of the substrate (8) on the basis of the position of the insulating coated wire (5), and a process for piercing holes on necessary positions and connecting respective substrates (8). COPYRIGHT: (C)2005,JPO&NCIPI
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