| 摘要 |
The present invention provides a method of assembling a printed circuit board (PCB) module intended for attachment to another structure, such as another larger PCB. In particular, the invention provides a plurality of different mounting fixtures for a PCB for enabling the selective enhancement of the thermal characteristics of the module. One embodiment of the invention provides a module comprising a PCB having a circuit mounted thereon and fixtures that, when attached to the PCB, result in an open frame or a baseplate module. A preferred circuit for said inventive assembly is a power conversion module designed to be mounted on another PCB that requires such power conversion in close proximity to the circuit components on the other board. The manufacturer of such power conversion or other modules can thus manufacture and pretest the board's electronics before assembly into either an open frame or baseplate module, while also providing inexpensive mounting fixtures to enable a user to select the type of heat dissipation provided by the module.
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