| 发明名称 |
THERMAL INTERFACE APPARATUS, SYSTEMS, AND METHODS |
| 摘要 |
<p>An apparatus and system, as well as fabrication methods therefor, may include a die having a surface and a primary material comprising tin, pure tin, or substantially pure tin coupled to the surface. A heat dissipating element may be coupled to the primary material.</p> |
| 申请公布号 |
WO2004095574(A1) |
申请公布日期 |
2004.11.04 |
| 申请号 |
WO2004US05054 |
申请日期 |
2004.02.19 |
| 申请人 |
INTEL CORPORATION |
发明人 |
JADHAV, SUSHEEL;DEPPISCH, CARL;HUA, FAY |
| 分类号 |
H01L23/373;(IPC1-7):H01L23/373 |
主分类号 |
H01L23/373 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
