MULTILAYER PRINTED WIRING BOARD-USE COPPER-CLAD LAMINATE SHEET, MULTILAYER PRINTED WIRING BOARD AND PRODUCTION METHOD FOR MULTILAYER PRINTED WIRING BOARD

摘要

A multilayer printed wiring board and a production method therefore which permit an easy positioning when a plurality of one-sided circuit boards having adhesive layers are to be stacked and reduce the occurrence of a positional deviation trouble by producing a multilayer printed wiring board by using a multilayer printed wiring board-use copper-clad laminate sheet (1) which is characterized by comprising, arranged in the order mentioned and integrated together, a solid copper foil (2) with a circuit not yet formed, a hard insulation layer (3) formed by hardening thermosetting resin, an adhesive layer (4) made temporarily meltable by heating, and a protection film (5).