发明名称 |
DEVICE FOR APPLYING SEMICONDUCTOR TREATMENT TO TREATMENT SUBJECT SUBSTRATE |
摘要 |
<p>A device for applying a semiconductor treatment to a treatment subject substrate (W) includes a lifting mechanism (48) disposed on a table (38) for assisting in delivering the treatment subject substrate. The lifting mechanism includes lifter pins (51) for supporting and lifting/lowering the treatment subject substrate, and guide holes (49) for guiding the lifting/lowering movement of the lifter pins. Each guide hole comprises a main hole portion (49a) extending from the upper surface to the lower surface and through the table, and an extension hole portion (49b) extending into an extension sleeve (66) projecting downward from the lower surface of the table correspondingly to the main hole portion.</p> |
申请公布号 |
WO2004095568(A1) |
申请公布日期 |
2004.11.04 |
申请号 |
WO2004JP05632 |
申请日期 |
2004.04.20 |
申请人 |
TOKYO ELECTRON LIMITED;ASAKURA, KENTARO |
发明人 |
ASAKURA, KENTARO |
分类号 |
C23C16/44;H01L21/00;H01L21/683;H01L21/687;(IPC1-7):H01L21/68 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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