发明名称 TAILORING NITROGEN PROFILE IN SILICON OXYNITRIDE USING RAPID THERMAL ANNEALING WITH AMMONIA UNDER ULTRA-LOW PRESSURE
摘要 A method of forming a dielectric film that includes nitrogen. The method includes incorporating nitrogen into a dielectric film using a nitridation gas and a rapid thermal annealing process, wherein an ultra-low pressure of equal to or less than about 10 Torr is used for the rapid thermal annealing process.
申请公布号 WO2004070796(A9) 申请公布日期 2004.11.04
申请号 WO2004US03442 申请日期 2004.02.04
申请人 APPLIED MATERIALS, INC.;NARWANKAR, PRAVIN, K.;MINER, GARY;LEPERT, ARAUD 发明人 NARWANKAR, PRAVIN, K.;MINER, GARY;LEPERT, ARAUD
分类号 H01L21/28;H01L21/3105;H01L21/314;H01L21/334;H01L29/51;(IPC1-7):H01L/ 主分类号 H01L21/28
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