发明名称 FLOOR STRUCTURE AND BUILDING
摘要 <P>PROBLEM TO BE SOLVED: To provide a floor structure and a building for easily keeping an indoor space comfortable. <P>SOLUTION: In the floor structure, a heating layer 2 for heating a floor is provided on the upper or lower part of or inside of a layer (a heat storage layer 5) of a heat storage material which has hysteresis property with a melting temperature zone higher than a coagulating temperature zone. This building has the heat storage material 5 arranged therein which has the hysteresis property with a melting temperature zone higher than a coagulating temperature zone. Preferably, the heat storage material 5 has a melting temperature zone of dominantly 30&deg;C or higher and a coagulating temperature zone of 28 &deg;C or lower. Thus, heat storage is performed at 30&deg;C or higher during floor heating. Cooling is quickly performed down to a room temperature of nearly 28&deg;C because the heat storage material is free of heat radiation before room temperature lowers down to nearly 28&deg;C even at turning on cooling operation in summer. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004308967(A) 申请公布日期 2004.11.04
申请号 JP20030100504 申请日期 2003.04.03
申请人 SEKISUI CHEM CO LTD 发明人 ASAGIRI DAISUKE
分类号 E04B1/74;E04F15/18;F24D11/00;F24F5/00 主分类号 E04B1/74
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