| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate polishing device which can suppress dispersion in grinding quantity. <P>SOLUTION: The substrate polishing device is formed of a stage 1 on which a substrate 30 is mounted; a polishing pad 6 placed opposed to the stage 1; a disk driving motor 8 and a stage driving motor 4 for driving the polishing pad 6 and the stage 1 so as to rotate relatively to each other; an abrasive feeding pump 12 for feeding an abrasive between the substrate 30 and the polishing pad 6; a cylinder 10 for pressing the polishing pad 6 toward the substrate 30; a current sensor for detecting load current of the disk driving motor 8; and a temperature sensor 13 for detecting the temperature of the substrate. According to the substrate polishing device, downward air pressure of the cylinder 10, rotational speeds of the driving motors 4, 8, and a fed amount of the abrasive by the abrasive feeding pump are variably adjusted by a control microcomputer installed in a controller 14, based on polishing information detected by the current sensor and the temperature sensor 13. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
