发明名称
摘要 PROBLEM TO BE SOLVED: To suppress thickness deviation of a molding obtained through thermoforming without great influence by cooling conditions at the time of extruded sheet manufacturing. SOLUTION: On both sides of a resin layer, where 0-50 pts.wt. rubber-like polymer is uniformly dispersed with respect to 100 pts.wt. methyl methacrylate resin, a resin layer, where 1-50 pts.wt. methyl methacrylate insoluble resin particles having a weight-average particle diameter of 0.1-100μm is uniformly dispersed with respect to 100 pts.wt. base resin, which is composed of 100 pts.wt. methyl methacrylate resin and 0-70 pts.wt. rubber-like polymer, is integrally laminated by multi-layer extrusion molding.
申请公布号 JP3584751(B2) 申请公布日期 2004.11.04
申请号 JP19980277557 申请日期 1998.09.30
申请人 发明人
分类号 B32B27/30;B29C47/06;B29C51/14;B29K33/04;B29L9/00;C08L33/10;(IPC1-7):B32B27/30 主分类号 B32B27/30
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