| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of the entire system, prevent a waste of energy and complicated change in setting accompanying a change in profile, and to eliminate variations among components, in substrate heating equipment. SOLUTION: In this substrate heating method, a printed board mounted with electronic components is put in a heating furnace having such a temperature gradient that the temperature in an upper part may become higher in the vertical direction, and then the printed board is moved up and down to be heat-treated in a desired temperature profile. COPYRIGHT: (C)2005,JPO&NCIPI
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