| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a CMP (chemical mechanical polishing) conditioner, improved in sharpness. <P>SOLUTION: In this CMP conditioner, an abrasive grain layer 22 has a central area 24 and a peripheral area 26. In the central area 24, two or more projecting parts 28 are formed at spaces from each other, and two or more super-abrasive grains 14 are mounted on the projecting parts in a metallurgical bonding phase 23. In the peripheral area 26, the super-abrasive grains 14 are mounted in a metallurgical bonding phase 23. The projecting part 28 has a height from the abrasive grain layer bottom part 22a between the adjacent projecting parts 28 larger than the mean particle diameter of the super-abrasive grains 14, the number of super-abrasive grains 14 mounted on each projecting part 28 is 11 to 500, and the occupying percentage of super-abrasive grains 14 to the whole area of the abrasive grain layer 22 in a plan view is set in the range of 20% to 80%. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
