| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve electrical connection and reliability by preventing conductive bumps from flowing in a substrate at the time of mounting electronic parts, such as IC chips or making a heat cycle test. <P>SOLUTION: A multilayer printed circuit board is arranged such that a non-through hole is formed in an insulating substrate having a conductive layer on one surface or opposite surfaces thereof with the non-through hole being filled with a conductor to form a via hole; that two or more layers of circuit boards, each obtained by forming a first conductive bump on the via hole, are stacked to establish connection between the individual circuit boards through the first conductive bumps; and that a second conductive bump is formed on a conductive layer of the outermost layer circuit board. A melting point T1 of the first conductive bump is higher than a melting point T2 of the second conductive bump. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
