发明名称 HEAT RADIATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a simply formed and easily manufacturable cooling device used for electronic equipment and performing the cooling of a heating part by collecting and radiating heat from the heating part in non-contact with the heating part. SOLUTION: In this heat radiating device for absorbing and radiating heat to and from a heating element, a single or a plurality of heat pipes are disposed so as to cover the heating surface of the heating element in no-contact therewith, a single or a plurality of radiant heat absorbing devices formed by combining heat pipes and fins as heat absorbing parts with the single or the plurality of heat pipes are connected to any portion, and the fins installed on the single or the plurality of radiant heat absorbing devices are disposed so that radiant heat radiated from a heat source becomes difficult to leak from the surface of the radiant heat absorbing devices facing the heat source. Also, the plate type thin hole heat pipes are used as the heat pipes. In addition, a heat radiating fin device is combined with the fan. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004308973(A) 申请公布日期 2004.11.04
申请号 JP20030100754 申请日期 2003.04.03
申请人 TS CORPORATION 发明人 HAYASAKA HIROTO
分类号 F28D15/02;H01L23/427;H05K7/20;(IPC1-7):F28D15/02 主分类号 F28D15/02
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