发明名称 |
Method for improved high current component interconnections |
摘要 |
A printed circuit board having at least one conductive region covered in solder paste has preformed solder elements placed on the solder paste in the conductive region. A component package is placed onto the printed circuit board over the conductive region and the solder is reflowed, forming a wide solder interconnection between the component and the conductive region of the printed circuit board.
|
申请公布号 |
US2004216917(A1) |
申请公布日期 |
2004.11.04 |
申请号 |
US20030427681 |
申请日期 |
2003.04.30 |
申请人 |
AMIR DUDI I.;SEARLS DAMION T. |
发明人 |
AMIR DUDI I.;SEARLS DAMION T. |
分类号 |
H05K1/02;H05K3/34;(IPC1-7):H05K1/11 |
主分类号 |
H05K1/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|