| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily and automatically perform measurement relating to a bonding wire by using an inexpensive device. <P>SOLUTION: A light source 14 and a translucent mirror 13 illuminate the part of a wire 41 on a chip 40 from a direction vertical to the chip upper surface 42. A camera 16 picks up the image of the part of the wire 41. A computer main body 21 acquires a plurality of images of the part of the wire 41 respectively corresponding to different focus positions from the camera 16, while controlling an actuator 17 through a drive circuit 18 and moving and controlling an objective lens 11 in a vertical direction. The computer main body 21 selects the image in which the difference of the contrast between a dark part where the wire 41 is positioned and a bright part where the wire 41 is not positioned is maximum from the plurality of images, and detects the height from the chip upper surface 42 of the wire 41 by the focus position corresponding to the selected image. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
