| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a polishing pad capable of polishing a surface to be polished at a high speed without forming polishing flaws on the surface to be polished. <P>SOLUTION: The polishing pad is constituted of bridged resin grains and resin matrixes whose elastic modulus is lower than that of the bridged resin grains. In the polishing pad, the elastic modulus of the bridged resin grains at 25°C is 1.0-10.0 GPa, and the average grain size of the bridged resin grains is 5-300μm. A difference between the elastic moduli of the bridged resin grains and the resin matrixes in the polishing pad at 25°C is 0.3-3.0 GPa. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
