| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and an equipment for inspecting the quality of a bonding joint without large structural effort, especially those which perform the method in a minimum time. <P>SOLUTION: Inspection force (5) is applied to wire directly by an ultrasonic tool (1). The inspection force is applied to a wire/bonding joint with the ultrasonic tool and in particular the inspection force is directed perpendicularly to the direction of wire in a bonding plane. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
