SEMICONDUCTOR MEMORY CHIP BEING MULTI-CHIP AND SUPPORTING MULTI-SECTOR ERASING OPERATION MODE, MULTI-CHIP PACKAGE, AND MULTI-SECTOR ERASING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor memory chip being multi-chip and supporting a multi-sector erasing operation mode of a multi-chip, and to provide a multi-chip package and a multi-sector erasing method.

SOLUTION: The semiconductor memory chip constituting the multi-chip package comprises a cell array, a register having sector information to be erased, an address clock driver generating simultaneously an address clock signal in multi-chip respectively, a counter generating successively addresses, a core driver performing erasing operation for the sector, and a control circuit controlling these components.

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