发明名称 PATTERN FORMING METHOD, PATTERN FORMING APPARATUS, PRODUCTION METHOD FOR DEVICE, CONDUCTIVE FILM WIRING, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a pattern forming method by which occurrence of variation in line width of film patterns and occurrence of unevenness on appearance can be suppressed when a plurality of film patterns are formed. SOLUTION: The pattern forming method for forming film patterns W1 to W3 by arranging droplets of a liquid material on a substrate 11 has a process in which a plurality of pattern forming regions R1 to R3 where the film patterns are formed on the substrate 11 are set and a process in which the film patterns W1 to W3 are formed by successively arranging a plurality of droplets in each of the plurality of set pattern forming regions R1 to R3. When the droplets are successively arranged, arranging sequence with which the droplets are arranged in each of the plurality of pattern forming regions R1 to R3 is made to be about the same. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004306015(A) 申请公布日期 2004.11.04
申请号 JP20040031045 申请日期 2004.02.06
申请人 SEIKO EPSON CORP 发明人 HIRAI TOSHIMITSU
分类号 B05D5/12;B05C5/00;B05D1/26;B05D7/00;H01L21/288;H01L21/3205;H01L29/786;H01L51/40;H05K3/00;H05K3/10;H05K3/12;(IPC1-7):B05D5/12;H01L21/320 主分类号 B05D5/12
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