发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device that can be protected against disturbance such as noise while deterred from increasing in manufacturing cost as a semiconductor device which has a movable part. SOLUTION: This semiconductor device uses SOI substrates as a signal processing substrate 1 and a sensor substrate 2, and is characterized in that a signal processing circuit part is formed on a 2nd silicon layer 1c insulated and separated from a 1st silicon layer 1a with an oxide film 1b of the signal processing substrate 1 and the movable part MV is formed on a 2nd silicon layer 2c insulated and separated from a 1st silicon layer 2a with an oxide film 2b of the sensor substrate 2. Potentials of the 1st silicon layer 1a and 1st silicon layer 2b can, therefore, be set to arbitrary values irrelevantly to potentials of the signal processing circuit and movable part MV, and are held at a ground potential to enable use as a shield layer preventing the movable part MV and signal processing circuit part from malfunctioning owing to external noise etc. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004311951(A) 申请公布日期 2004.11.04
申请号 JP20030430049 申请日期 2003.12.25
申请人 DENSO CORP 发明人 FUJII TETSUO
分类号 G01P15/125;B81B3/00;B81B7/00;G01P1/02;G01P15/08;H01L23/00;H01L23/12;H01L23/50;H01L23/552;H01L25/065;H01L29/76;H01L29/84;H01L31/062;(IPC1-7):H01L29/84 主分类号 G01P15/125
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