| 摘要 |
PROBLEM TO BE SOLVED: To provide a water cooling structure suitable for down-sized and thin model, in which circular liquid flow rate is necessary and sufficient for coping with increase of heat from a heating element accompanied with improvement of processing performance of an electronic equipment. SOLUTION: A water cooling jacket 8 is thermally connected to a heating element 7 and a heat sink pipe 9 is thermally connected to a heat slinger 10 installed in a back surface of a display 2. Cooling medium liquid is circulated by a liquid driving gear 11 between the water cooling jacket 8 and the heat sink pipe 9. A necessary and sufficient circular liquid flow rate and necessary discharge pressure are defined in terms of relation between upper limit temperature of the heating element 7 and maximum heat radiation which can be radiated from a surface of a housing. Thus, the heat from the heating element can be radiated from the back surface of the display case 2 with the necessary and sufficient circular liquid flow rate. COPYRIGHT: (C)2005,JPO&NCIPI
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