METHOD FOR PLATING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a method for plating an electronic component, which stabilizes a thickness of a plated layer. SOLUTION: The method for plating the electronic component comprises an immersion step of accommodating an article 1 to be plated and a medium 2 in a barrel 4 having the tip 5a of an electrode 5 therein, and simultaneously immersing the barrel 4 in a plating liquid 6; a plating step of forming a plating layer on the surface of the article 1 by applying an electric current to the article 1 and the medium 2 with the use of the electrode 5; and making the specific gravity of the article 1 approximately equal to that of the medium 2. COPYRIGHT: (C)2005,JPO&NCIPI