Durch Energiestrahl härtbare, hydrophile und druckempfindliche Klebstoffzusammensetzung und deren Verwendung

摘要

An energy beam curable hydrophilic pressure sensitive adhesive composition comprising a hydrophilic pressure sensitive adhesive (A) and an energy beam polymerizable compound (B), optionally together with a photopolymerization initiator (C) added according to necessity. The pressure sensitive adhesive composition is suitable for use in a wafer surface protective sheet, enabling easy removal of any residual pressure sensitive adhesive by washing with water, even if pressure sensitive adhesive remains on the wafer surface after peeling of the pressure sensitive adhesive sheet.