| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a through hole forming method in which a work to be irradiated can be reliably cooled and a scattered material can be reliably removed without damaging the work when irradiating laser beams, and a through hole can be efficiently formed. <P>SOLUTION: The through hole forming method includes a step of forming a through hole H penetrated in a base body 11 in the thickness direction by irradiating laser beams L at a predetermined part of the base body 11, and a step of expanding the diameter of the through hole H by passing a gas A into the through hole to discharge scraps present in the through hole outside the through hole, and grinding an inner face of the through hole H by irradiating laser beams L at the circumference of the through hole H while cooling the base body 11. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
