| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing epoxy resin molding material excellent in filling properties suitable as an underfil material for flip chip packaging, and a flip chip packaging type semiconductor device sealed therewith which has good failure of molding such as a void. SOLUTION: In the epoxy resin molding material for sealing the semiconductor package having an epoxy resin (A), a curing agent (B), and an inorganic filler (C) as the essential components, the inorganic filler (C) has an average particle diameter of≤12μm and a specific surface area of≥3.0 m<SP>2</SP>/g. COPYRIGHT: (C)2005,JPO&NCIPI |
