| 摘要 |
A laminating device 10 includes a vacuum grid 19 for holding a glass substrate 12, a curved pad 20, facing the glass substrate 12, for holding a laminated element 16 of a wafer 13 and an adhesive tape 15, and a driving element 22 for moving the curved pad 20 toward the vacuum grid 19. The curved pad 20 has a curved surface region 46 so that the distance to a smooth surface region 39 of the vacuum grid 19 is gradually increased from the center C toward the outside. By the driving element 22, the vacuum grid 19 and the curved pad 20 become close to each other in a substantially vacuum chamber. As a result, the glass substrate 12 and the laminated element 16 are gradually laminated to each other while removing a very small amount of air that may be present therebetween to the outside. |
