| 摘要 |
A resin composition, substrate material, sheet, laminated board, resin-bearing copper foil, copper-clad laminate, TAB tape, printed circuit board, prepreg and adhesive sheet are provided which exhibit improved physical properties, dimensional stability, heat resistance and flame retardance, particularly high-temperature physical properties. <??>A resin composition containing 100 parts by weight of a thermoplastic resin and 0.1 - 65 parts by weight of an inorganic compound, the resin composition having a mean linear expansion coefficient ( alpha 2) of 1.0x10<-3> Ä DEG C<-1>Ü or below over the temperature range from a temperature 10 DEG C higher than a glass transition temperature of the resin composition to a temperature 50 DEG C higher than the glass transition temperature of the resin composition.
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