| 摘要 |
PURPOSE: A DC-DC converter implemented in an LGA(Land Grid Array) package is provided to minimize stray inductance, to obtain a high conductivity interconnection between components and a high conductivity/low inductance path to external interconnect points, and to transfer efficiently the heat of the converter to the outside. CONSTITUTION: A semiconductor chip package(100) includes a substrate, via, a die attach pad, a DC-DC converter and an external pad of a land grid array. The substrate(102) includes a top surface and a bottom surface. The via includes a first end adjacent to the top surface and a second end adjacent to the bottom surface. The via is prolonged through the substrate. The die attach pad is mounted on the top surface to be electrically or thermally connected to the via. The DC-DC converter includes a power silicon die with a bottom electrode surface thermally connected to the die attach pad. The external pad is mounted on the bottom surface. |
