发明名称 |
Bridges for microelectromechanical structures |
摘要 |
A conductive bridge (16) in a second conductive layer may be utilized to join a pair of spaced apart conductive strips (12) in a first conductive layer. A gap (44) between the first and second strips (12) may be bridged by the bridge (16) while isolating both the first and second strips (12) and the bridge (16) itself from another conductor (18) which extends through the gap (44) between the first and second strips (12). <IMAGE> |
申请公布号 |
EP1375417(A3) |
申请公布日期 |
2004.11.03 |
申请号 |
EP20030012610 |
申请日期 |
2003.06.03 |
申请人 |
INTEL CORPORATION |
发明人 |
MA, QING;CHOU, TSUNG-KUAN ALLEN |
分类号 |
B81C1/00;B81B7/00;B81B7/02;H01L21/3205;H01L21/768;H01L21/822;H01L23/52;H01L23/522;H01L23/66;H01L27/04;(IPC1-7):B81B7/00;B81B3/00 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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