发明名称 Bridges for microelectromechanical structures
摘要 A conductive bridge (16) in a second conductive layer may be utilized to join a pair of spaced apart conductive strips (12) in a first conductive layer. A gap (44) between the first and second strips (12) may be bridged by the bridge (16) while isolating both the first and second strips (12) and the bridge (16) itself from another conductor (18) which extends through the gap (44) between the first and second strips (12). <IMAGE>
申请公布号 EP1375417(A3) 申请公布日期 2004.11.03
申请号 EP20030012610 申请日期 2003.06.03
申请人 INTEL CORPORATION 发明人 MA, QING;CHOU, TSUNG-KUAN ALLEN
分类号 B81C1/00;B81B7/00;B81B7/02;H01L21/3205;H01L21/768;H01L21/822;H01L23/52;H01L23/522;H01L23/66;H01L27/04;(IPC1-7):B81B7/00;B81B3/00 主分类号 B81C1/00
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