Manufacturing method of a lead frame for power semiconductor electronic devices, separating the leads and downsetting the die pad in one step

摘要

A method for manufacturing semiconductor electronic devices (1) comprising the step of: forming, from a plane metallic foil defining a lie plane, a supporting frame (2) comprising a mount pad (3) for said devices and corresponding leads (4) being short-circuited to said mount pad (3), characterised in that it comprises the steps of: downsetting said mount pad (3) on a plane being parallel to said lie plane keeping at least a group of leads (4) on said lie plane and separating by shearing said mount plane (3) from said group of leads (4), mounting a die on a first surface of said mount pad (3), forming the electrical connections between said die and said group of leads (4), encapsulating said frame (2) in a protective package (6) so as to leave the second surface of said mount pad (3), being opposite to said first surface, exposed from said protective package (6).