METHODS FOR MAKING REINFORCED WAFER POLSHING PADS AND APPARATUSES IMPLEMENTING THE SAME

摘要

As one of many embodiments of the present invention, a seamless polishing apparatus for utilization in chemical mechanical polishing is provided. The seamless polishing apparatus includes a polishing pad (156) where the polishing pad (156) is shaped like a belt and has no seams. The seamless polishing apparatus also includes a base belt (157) where the base belt (157) includes a reinforcement layer (182) and a cushioning layer (184). In addition, the cushioning layer (184) is an intermediary layer between the polishing belt pad (156) and the base belt (157).