Solid-state imaging device and method for producing the same

摘要

A solid-state imaging device includes: a planar substrate 1; an imaging element 2 fixed onto the substrate; a rib 3 provided on the substrate so as to surround the imaging element; a transparent plate 4 fixed to a top face of the rib; a plurality of wirings 6 for conducting electricity from inside of a package to outside of the same, the package being composed of the substrate, the rib and the transparent plate; and thin metal wires 7 for connecting electrodes of the imaging element with the respective wirings. Each of the wirings includes: an internal electrode 6a disposed on a surface with the imaging element mounted thereon; an external electrode 6b disposed on a rear surface of the imaging-element mounted surface and at a position corresponding to the internal electrode and an end face electrode 6c disposed on an end face of the substrate, for connecting the internal electrode and the external electrode. An end face of the substrate, a side face of the nb and an end face of the transparent plate form a substantially coplanar surface. The structure of the substrate having an external terminal is simple, thus facilitating the miniaturization of the device.